The book discusses the latest trends such as 4D printing, wire arc additive manufacturing (WAAM), direct energy deposition, and topological optimization in additive manufacturing (AM), and its compliance with the ASTM/ISO standards. It further explains materials for additive manufacturing and the development of novel future materials.  
The focus of this book is to cover the fundamentals, principles, selection of material and equipment, and applications of additive manufacturing (AM) in a comprehensive manner. It will showcase information about the effective utilization of additive manufacturing for advanced applications in diverse areas such as biomedical, aerospace, automobile, defence, and reverse engineering. The other main features are-                                                                                                                  
·       Covers comprehensive discussion on the theoretical aspects of additive manufacturing such as sintering, diffusion, and photopolymerization.                                                                                                        
·       Showcases applications of additive manufacturing in diverse fields including aerospace engineering, automotive engineering, biomedical engineering, and reverse engineering.                                                                                                                
·       Presents case studies to showcase real-time problems and solutions using additive manufacturing.                                                                                                        
·       Includes pedagogical features such as algorithms, exercises, and case studies.                                                                                                      
The text is primarily written for senior undergraduate, graduate students, and academic researchers in the fields of manufacturing engineering, industrial engineering, production engineering, mechanical engineering, and aerospace engineering.